TLMI Announces Association’s Scholarship Portal is officially Open and Online
January 16, 2019 (Milford, OH): TLMI announces the association’s Scholarship Portal is now open and online at tlmi.com. Prospective applicants can complete scholarship applications and reference forms through the portal where they will also find information about each of TLMI’s Scholarship Programs. The deadline for applications is April 5, 2019.
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TLMI provides scholarships to candidates that fall within one of three categories including two-year college degree programs, four-year college degree programs and full-time employees of TLMI member companies. The association provides one graduate-degree program scholarship annually to a full-time employee of a member company who is pursuing a graduate degree. Scholarship selection is based on academic achievement, a demonstrated interest in the label and packaging industry, a statement of goals and a personal interview.
Jessica Johnson, TLMI’s Program Director, comments, “The TLMI Scholarship Program has assisted hundreds of students across the U.S. and Canada. These accomplished students graduate to become valuable assets to the companies they work for. Recipients carve out careers in areas that have included printed packaging production, engineering, design and purchasing. Workforce development is a core pillar of the TLMI Strategic Plan and an area where we will be dedicating increased resources in the coming year. I look forward to working with the Workforce Development Committee and the Scholarship Subcommittee in moving these initiatives forward and to delivering impactful recruitment resources to our members.”
More information about TLMI’s Scholarship Programs can be found here. Jessica Johnson can be reached at jessica.johnson@tlmi.com.
Source: TLMI
