Free Open House - The Future of Flexo: New Year, New Technology presented by OMET
Join us for a FREE open house on Feb. 6-7 presented by OMET Americas at Clemson University's Sonoco Institute.
- Connect with vendors from across the flexo industry to explore their latest technologies
- Determine which industry advancements to consider for your 2019 budget planning
- Join Durst-led discussions around digital inkjet technology, capabilities and justification
- Enjoy speakers, vendors, industry networking and free food
Join us in beautiful Clemson, SC at the Sonoco Institute of Packaging Design and Graphics, the premiere source of talent and discovery for printing and packaging innovation. The Institute's Advanced Print Lab, which houses OMET's Varyflex narrow-web press, provides a hub for industry suppliers, brand owners and others to gather and get their hands on the latest technologies.
Sponsored by Phoseon, Harper, Nazdar, Siegwerk, Eaglewood, DuPont, Techkon, DBT Coatings, OMET and Clemson University.
Please click the orange BUY TICKETS button to RSVP everyone in your party for free.
Agenda / Shuttle Info:
http://blogs.clemson.edu/sonocoinstitute/files/2019/01/Agenda-Shuttle-Info.pdf
Wednesday, February 6 at 10:00am to 5:00pm
Sonoco Institute at Clemson University 311 Harris A. Smith Building
Source: Clemson University's Sonoco Institute