Sonoco Institute Paperboard Packaging Seminar

Date: Pricing: February 27-28, 2019
$995/person (or $895/person for groups of 3+)

 

Event Overview 

This seminar provides a comprehensive, hands-on exploration of Paperboard Packaging Technologies. Upon completing this program, attendees will be equipped to make valuable contributions to critical packaging decisions. Individuals involved in package design, sales, specification, purchasing, scheduling, quality control, and production management will benefit from this seminar. This seminar is appropriate for all levels of experience.

Presentation Topics Include: 

• Paperboard Substrates and Applications
• Paperboard Manufacturing
• Characteristics of Paperboard
• Packaging Sustainability
• Package Design
• Prepress
• Printing and Converting

Hands-On Sessions: 

• Packaging Materials
• Manufacturing Effects
• Characteristic Test Comparisons
• Design Breakout Session
• Printing Comparisons
• Die Cutting and Scoring

Previous Presenters and Contributors: 

• Dan Malenke, PKGPRO
• Ken Perry, Kapstone Charleston Kraft
• Phil Bradley, MWV
• Pat Shields, RockTenn
• Andrew Hurley, Clemson
• William Beck, MWVe
• Jim Hare, Kapstone Charleston Kraft
• Lizzy Zinn, Epic Products
• Aric Naylor, Atlas Die
• Bill Sommer, Sonoco Products
• Phil Jones, Imerys
• Eric Ferguson, Datalase
• Chuck Tarlton, Graphic Packaging
• Gary Bernier, HP Indigo
• Tom Blanck, Chainalytics
• Kemp Wall, Essentra
• Paul Schutes, Recycled Paper Technical Assn.
  
  

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Source: Clemson University's Sonoco Institute